Projects | KDT JU

Project Impact articles

As projects supported by the KDT JU (and its predecessor ECSEL JU) come to fruition, they can deliver important and impactful results. A collection of articles documenting these has been collected.

Discover these articles here

View

All projects

JU Era

KDT (since Dec 2021)

ECSEL (before Dec 2021)

AI-TWILIGHT

Call year: 2020

AI-TWILIGHT will merge the virtual and physical worlds to pave the way for innovations in fields where the European lighting industry is likely to be competitive.

AI4CSM

Call year: 2020

AI4CSM will realize a novel architecture for ECS in electrical vehicles, needed when electro mobility becomes mainstream, driving digitalisation to foster mobility as a service, and connected, shared operation.

AIDOaRt

Call year: 2020

AIDOaRt will develop a model-based framework to support teams during the automated continuous development of CPSs by means of integrated, AI-augmented solutions.

DAIS

Call year: 2020

DAIS will create an intelligence centred heterogeneous distributed edge computing systems and solutions.

Energy ECS

Call year: 2020

The project will develop a set of technologies to improve the digitalization of e-mobility systems and related energy solutions.

GaN4AP

Call year: 2020

GaN4AP will make GaN-based electronics one of the main technology for active devices in all power conversion systems in Europe.

HiEFFICIENT

Call year: 2020

Highly efficient and reliable electric drivetrains based on modular, intelligent and highly integrated wide band gap power electronics modules.

ID2PPAC

Call year: 2020

ID2PPAC demonstrates that Performance Power Area and Cost (PPAC) requirements for the 2nm node generation of leading-edge logic technology can be achieved.

IMOCO4.E

Call year: 2020

IMOCO4.E provides vertically distributed, edge-to-cloud intelligence for machines, robots and other human-in-the-loop automation systems having actively controlled moving elements.

MATQu

Call year: 2020

MATQu will validate technology options to produce SJJs on industrial 300 mm silicon-based process flows.

StorAIge

Call year: 2020

StorAIge will develop and industrialize the FD-SOI 28nm and the next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies.

TRANSACT

Call year: 2020

TRANSACT will develop a universal, distributed solution architecture for the transformation of safety-critical cyber-physical systems, from localised standalone systems into safe and secure distributed solutions leveraging edge and cloud computing.

TRANSFORM

Call year: 2020

TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry.

YESvGaN

Call year: 2020

YESvGaN will establish a new class of vertical GaN power transistors which combines the performance benefits of vertical Wide Band Gap (WBG) transistors with the cost advantages of established silicon technology.

ADACORSA

Call year: 2019

Safe, reliable and secure drone operation in all situations and flight phases.

ArchitectECA2030

Call year: 2019

Trustable architectures with acceptable residual risk for the electric, connected and automated cars.

BEYOND5

Call year: 2019

A completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond.

BRAINE

Call year: 2019

Positioning Europe at the forefront of the intelligent edge computing field.

CHARM

Call year: 2019

Digitalization has been identified as one of the key enablers for renewal and competitiveness of European manufacturing industries.

FRACTAL

Call year: 2019

To achieve an industrial edge, new computing devices are required to provide a new set of challenging requirements such as time-predictability, safety, reliability, energy-efficiency, and security.

InSecTT

Call year: 2019

Intelligent, secure and trustworthy systems for industrial applications.

iRel4.0

Call year: 2019

iRel40 has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain.

IT2

Call year: 2019

Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommod

Moore4Medical

Call year: 2019

Moore4Medical will accelerate innovation in electronic medical devices.

NextPerception

Call year: 2019

Next generation smart perception sensors and distributed intelligence for proactive human monitoring in health, wellbeing, and automotive systems

PROGRESSUS

Call year: 2019

Highly efficient and trustworthy electronics, components and systems for the next generation energy supply infrastructure.

VALU3S

Call year: 2019

VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements.

AI4DI

Call year: 2018

The mission of the AI4DI project is to make Europe the leader in Silicon-born-Artificial Intelligence for accelerated edge processing.

APPLAUSE

Call year: 2018

APPLAUSE develops advanced packaging and assembly technologies for combined electronics, optics and photonics, targeting high-volume, low-cost manufacturability.

Arrowhead Tools

Call year: 2018

Arrowhead Tools is a very ambitious project which will bring innovative digitalisation and automation solutions for European industry, closing the gaps that hinder IT/OT integration.

COMP4DRONES

Call year: 2018

Framework of Key Enabling Technologies for Safe and Autonomous Drones

CPS4EU

Call year: 2018

CPS is a key driver for the innovation capacity of European industries, large and small, generating economic growth and supporting meaningful jobs for citizens.

HELIAUS

Call year: 2018

HELIAUS is a first and essential step to the creation of a future industrialized affordable thermal perception systems.

MADEin4

Call year: 2018

Metrology Advances for Digitized Electronic Components and Systems Industry 4.0

NewControl

Call year: 2018

NewControl will develop virtualized platforms for vehicle subsystems that are essential to highly automated driving.

PIN3S

Call year: 2018

Pilot Integration of 3nm Semiconductor Technology.

Power2Power

Call year: 2018

Power2Power fosters a holistic, digitised pilot line approach in the Power ECS domain by accelerating the transition of ideas to innovations.

TEMPO

Call year: 2018

Massive adoption of computing in all aspects of human activity has led to unprecedented growth in the amount of data generated.

UltimateGaN

Call year: 2018

UltimateGaN will safeguard Europe’s leading position in power semiconductors and high-performance RF applications by driving an innovative breakthrough with the next generation of Gallium Nitride (GaN) technologies.

VIZTA

Call year: 2018

VIZTA will develop innovative technologies for optical sensors and laser sources used in short to long-range 3D-imaging.

5G_GaN2

Call year: 2017

The fifth generation (5G) communications technologies will provide internet access to a wide range of applications.

AFarCloud

Call year: 2017

It will provide a distributed platform for autonomous farming, which will allow the integration and cooperation of Cyber Physical Systems in real-time.

FITOPTIVIS

Call year: 2017

Images play a central role in human perception and understanding of our environment.

HiPERFORM

Call year: 2017

Wide band-gap power electronics in the drivetrain of electric vehicles.

iDev40

Call year: 2017

Integrated ECS development processes, safe and secure digital automation workflow.

OCEAN12

Call year: 2017

For the last years, electronic components become more and more widespread in the automotive industry.

POSITION-II

Call year: 2017

A pilot line for realising the next generation of smart catheters and implants.

PRYSTINE

Call year: 2017

Fail-operational Urban Surround Perception (FUSION) based on robust Radar and LiDAR sensor fusion and control functions.

REACTION

Call year: 2017

The first worldwide and European eight-inch SiC wafer pilot line facility for power technology.

SECREDAS

Call year: 2017

Software for validating architecting methodologies, reference architectures, components and suitable integration.

TAPES3

Call year: 2017

Supporting the continuation of Moore’s law in line with the worldwide industry roadmap.

WAKeMeUP

Call year: 2017

WAKeMeUP will set-up a pilot line for advanced microcontrollers with e

AQUAS

Call year: 2016

Growing complexity of systems creates increasing difficulty with providing assurance for safety, security and performance.

AutoDrive

Call year: 2016

Highly and fully automated driving for safer, efficient, affordable, and user-friendly future mobility.

CONNECT

Call year: 2016

Innovative smart components, modules and appliances for a truly connected, efficient and secure smart grid.

EuroPAT-MASIP

Call year: 2016

Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses.

I-MECH

Call year: 2016

Intelligent Motion Control Platform for Smart Mechatronic Systems

MegaM@Rt2

Call year: 2016

MegaM@Rt will create a framework incorporating methods and tools for continuous development and validation.

MICROPRINCE

Call year: 2016

Micro-Transfer-Printing of Functional Components on Wafer Level.

Productive4.0

Call year: 2016

Productive4.0 is an ambitious holistic project addressing all domains of the Digital Industry, thus comprising the complete range of Industry 4.0.

R3-POWERUP

Call year: 2016

300mm Pilot Line for Smart Power and Power Discretes.

SCOTT

Call year: 2016

SCOTT will Significantly impact the European Union to achieve the full potential of the IoT.

SILENSE

Call year: 2016

Acoustic technologies & concepts to activate and control devices by gesture, data communication, and indoor positioning.

TAKEMI5

Call year: 2016

Discovering, developing and demonstrating lithographic, metrology, process and integration technologies enabling module integration for the 5nm node.

TARANTO

Call year: 2016

Towards Advanced bicmos NanoTechnology platforms for rf to thz applications.

WInSiC4AP

Call year: 2016

Wide band gap Innovative SiC for Advanced Power.

3DAM

Call year: 2015

Development of a new generation of metrology and characterization tools and methodologies.

AMASS

Call year: 2015

Open tool platform, ecosystem & self-sustainable community for assurance and certification of Cyber-Physical Systems.

ASTONISH

Call year: 2015

Better, faster and cheaper diagnosis is one of the key challenges of modern healthcare.

DELPHI4LED

Call year: 2015

The rise of LED technology is changing the ecosystem of the lighting industry.

DENSE

Call year: 2015

Self-driving cars are a rapidly growing technology. They eliminate the human error which is responsible for the highest percentage of accidents.

ENABLE S3

Call year: 2015

Highly automated systems help to solve many societal challenges but can be costly to develop, test and certify for safe use.

EnSO

Call year: 2015

Autonomous Micro Energy Sources (AMES) for the “Internet of Things” (IoT)

IoSense

Call year: 2015

Boosting European ECS industry competitiveness with connected semiconductor pilot lines in Europe.

PRIME

Call year: 2015

The goal of PRIME is to establish an open Ultra Low Power technology platform, containing all necessary design and architecture blocks and components needed to support supply of products for the IoT.

REFERENCE

Call year: 2015

Today’s world is overwhelmingly digitalized. The integration of information and communication technologies in people’s lives is unprecedented, and the volume of data being constantly exchanged is growing drastically.

SafeCOP

Call year: 2015

Next generation embedded systems are interconnected through wireless communication.

SemI40

Call year: 2015

Speeding up Europe's semiconductors production in the Industry 4.0 applications.

TAKE5

Call year: 2015

5nm patterning, supporting the International Technology Roadmap for Semiconductors.

RobustSENSE

Call year: 2014

Enhanced sensing performance for more reliable automated and autonomous driving functions for safe operation under all driving conditions

3CCAR

Call year: 2014

3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV).

ADMONT

Call year: 2014

Advanced Distributed Pilot Line for More-than-Moore Technologies.

EXIST

Call year: 2014

New technologies for innovative image sensors focused on enhancing and extending the capabilities of current CMOS imaging devices

InForMed

Call year: 2014

A pilot line for micro-fabricated medical devices enabling optimal use of the technologies and competencies available in Europe

MANTIS

Call year: 2014

Maintenance is expensive - from 30% to 50% of the total manufacturing cost. MANTIS will develop a Proactive Maintenance Service Platform Architecture designed to reduce the costs and create new ways to add value.

OSIRIS

Call year: 2014

OSIRIS proposes a large improvement of Silicon Carbide (SiC) wafers.

PowerBase

Call year: 2014

Strenghtening growth and strategic independence for European semiconductor industry

R2POWER300

Call year: 2014

Pilot line for new generations of Smart Power and Discrete technologies

SeNaTe

Call year: 2014

Paving the way to the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.

SWARMs

Call year: 2014

Autonomous operations of underwater robots at new reduced operational cost, increased safety of tasks and help to expand the offshore sector.

WAYTOGO FAST

Call year: 2014

Distributed research infrastructure in the nanoCMOS domain influencing the whole value chain of digital electronics in Europe.