Advanced Packaging and Heterogenous Integration
- Call identifier Chips-2023-CPL-3
- Found in Appendix 2023 Initiative
- Call Open 1 December 2023
- Call Closed 29 February 2024
Deadlines
The Pilot Lines Calls will be single-stage calls with submission of Full Project Proposal (FPP).
- Opening date: 1st February 2024
- Deadline (FPP proposals): at 17:00:00 Brussels time on 29 February 2024
- Only proposals submitted in each of the three interrelated calls will be eligible for evaluation.
Important!
Q & A
This page is designed to address the most common inquiries from our participants, delivering essential insights and guidance.
Here, you will find a comprehensive compilation of responses aimed at enriching your understanding and facilitating your participation.
Proposal Submission
We invite you to submit your proposal for this collective initiative for the further development and excellence in technology innovations
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