Projects

Project Impact articles

As projects supported by the KDT JU (and its predecessor ECSEL JU) come to fruition, they can deliver important and impactful results. A collection of articles documenting these has been collected.

 Discover these articles here

View
By year
JU Era
Thumbnail

AI-TWILIGHT

Call year: 2020
AI-TWILIGHT will merge the virtual and physical worlds to pave the way for innovations in fields where the European lighting industry is likely to be competitive.
Thumbnail

AI4CSM

Call year: 2020
AI4CSM will realize a novel architecture for ECS in electrical vehicles, needed when electro mobility becomes mainstream, driving digitalisation to foster mobility as a service, and connected, shared operation. 
Thumbnail

AIDOaRt

Call year: 2020
AIDOaRt will develop a model-based framework to support teams during the automated continuous development of CPSs by means of integrated, AI-augmented solutions.
Thumbnail

DIAS

Call year: 2020
DAIS will create an intelligence centred heterogeneous distributed edge computing systems and solutions.
Thumbnail

Energy ECS

Call year: 2020
The project will develop a set of technologies to improve the digitalization of e-mobility systems and related energy solutions.
Thumbnail

GaN4AP

Call year: 2020
GaN4AP will make GaN-based electronics one of the main technology for active devices in all power conversion systems in Europe.
Thumbnail

HiEFFICIENT

Call year: 2020
Highly efficient and reliable electric drivetrains based on modular, intelligent and highly integrated wide band gap power electronics modules.
Thumbnail

ID2PPAC

Call year: 2020
ID2PPAC demonstrates that Performance Power Area and Cost (PPAC) requirements for the 2nm node generation of leading-edge logic technology can be achieved.
Thumbnail

IMOCO4.E

Call year: 2020
IMOCO4.E provides vertically distributed, edge-to-cloud intelligence for machines, robots and other human-in-the-loop automation systems having actively controlled moving elements.
Thumbnail

MATQu

Call year: 2020
MATQu will validate technology options to produce SJJs on industrial 300 mm silicon-based process flows.
Thumbnail

StorAIge

Call year: 2020
StorAIge will develop and industrialize the FD-SOI 28nm and the next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies.
Thumbnail

TRANSACT

Call year: 2020
TRANSACT will develop a universal, distributed solution architecture for the transformation of safety-critical cyber-physical systems, from localised standalone systems into safe and secure distributed solutions leveraging edge and cloud computing.
Thumbnail

TRANSFORM

Call year: 2020
TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry.
Thumbnail

YESvGaN

Call year: 2020
YESvGaN will establish a new class of vertical GaN power transistors which combines the performance benefits of vertical Wide Band Gap (WBG) transistors with the cost advantages of established silicon technology.
Thumbnail

ADACORSA

Call year: 2019
Safe, reliable and secure drone operation in all situations and flight phases.
Thumbnail

ArchitectECA2030

Call year: 2019
Trustable architectures with acceptable residual risk for the electric, connected and automated cars.
Thumbnail

BEYOND5

Call year: 2019
A completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond.
Thumbnail

BRAINE

Call year: 2019
Positioning Europe at the forefront of the intelligent edge computing field.
Thumbnail

CHARM

Call year: 2019
Digitalization has been identified as one of the key enablers for renewal and competitiveness of European manufacturing industries.
Thumbnail

FRACTAL

Call year: 2019
To achieve an industrial edge, new computing devices are required to provide a new set of challenging requirements such as time-predictability, safety, reliability, energy-efficiency, and security.
Thumbnail

InSecTT

Call year: 2019
Intelligent, secure and trustworthy systems for industrial applications.
Thumbnail

iRel4.0

Call year: 2019
iRel40 has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain.
Thumbnail

IT2

Call year: 2019

Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommod

Thumbnail

Moore4Medical

Call year: 2019
Moore4Medical will accelerate innovation in electronic medical devices.
Thumbnail

NextPerception

Call year: 2019
Next generation smart perception sensors and distributed intelligence for proactive human monitoring in health, wellbeing, and automotive systems
Thumbnail

PROGRESSUS

Call year: 2019
Highly efficient and trustworthy electronics, components and systems for the next generation energy supply infrastructure.
Thumbnail

VALU3S

Call year: 2019
VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements.
Thumbnail

AI4DI

Call year: 2018

The mission of the AI4DI project is to make Europe the leader in Silicon-born-Artificial Intelligence for accelerated edge processing.

Thumbnail

APPLAUSE

Call year: 2018
APPLAUSE develops advanced packaging and assembly technologies for combined electronics, optics and photonics, targeting high-volume, low-cost manufacturability.
Thumbnail

Arrowhead Tools

Call year: 2018
Arrowhead Tools is a very ambitious project which will bring innovative digitalisation and automation solutions for European industry, closing the gaps that hinder IT/OT integration.
Thumbnail

COMP4DRONES

Call year: 2018
Framework of Key Enabling Technologies for Safe and Autonomous Drones
Thumbnail

CPS4EU

Call year: 2018
CPS is a key driver for the innovation capacity of European industries, large and small, generating economic growth and supporting meaningful jobs for citizens.
Thumbnail

HELIAUS

Call year: 2018
HELIAUS is a first and essential step to the creation of a future industrialized affordable thermal perception systems.
Thumbnail

MADEin4

Call year: 2018
Metrology Advances for Digitized Electronic Components and Systems Industry 4.0
Thumbnail

NewControl

Call year: 2018
NewControl will develop virtualized platforms for vehicle subsystems that are essential to highly automated driving.
Thumbnail

PIN3S

Call year: 2018
Pilot Integration of 3nm Semiconductor Technology.
Thumbnail

Power2Power

Call year: 2018
Power2Power fosters a holistic, digitised pilot line approach in the Power ECS domain by accelerating the transition of ideas to innovations.
Thumbnail

TEMPO

Call year: 2018

Massive adoption of computing in all aspects of human activity has led to unprecedented growth in the amount of data generated.

Thumbnail

UltimateGaN

Call year: 2018
UltimateGaN will safeguard Europe’s leading position in power semiconductors and high-performance RF applications by driving an innovative breakthrough with the next generation of Gallium Nitride (GaN) technologies.
Thumbnail

VIZTA

Call year: 2018

VIZTA will develop innovative technologies for optical sensors and laser sources used in short to long-range 3D-imaging.

Thumbnail

5G_GaN2

Call year: 2017
The fifth generation (5G) communications technologies will provide internet access to a wide range of applications.
Thumbnail

AFarCloud

Call year: 2017
It will provide a distributed platform for autonomous farming, which will allow the integration and cooperation of Cyber Physical Systems in real-time.
Thumbnail

AQUAS

Call year: 2017
Growing complexity of systems creates increasing difficulty with providing assurance for safety, security and performance.
Thumbnail

AutoDrive

Call year: 2017
Highly and fully automated driving for safer, efficient, affordable, and user-friendly future mobility.
Thumbnail

CONNECT

Call year: 2017
Innovative smart components, modules and appliances for a truly connected, efficient and secure smart grid.
Thumbnail

EuroPAT-MASIP

Call year: 2017
Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses.
Thumbnail

FITOPTIVIS

Call year: 2017

Images play a central role in human perception and understanding of our environment.

Thumbnail

HiPERFORM

Call year: 2017
Wide band-gap power electronics in the drivetrain of electric vehicles.
Thumbnail

I-MECH

Call year: 2017
Intelligent Motion Control Platform for Smart Mechatronic Systems
Thumbnail

iDev40

Call year: 2017
Integrated ECS development processes, safe and secure digital automation workflow.
Thumbnail

MegaM@Rt2

Call year: 2017
MegaM@Rt will create a framework incorporating methods and tools for continuous development and validation.
Thumbnail

MICROPRINCE

Call year: 2017
Micro-Transfer-Printing of Functional Components on Wafer Level.
Thumbnail

OCEAN12

Call year: 2017

For the last years, electronic components become more and more widespread in the automotive industry.

Thumbnail

POSITION-II

Call year: 2017
A pilot line for realising the next generation of smart catheters and implants.
Thumbnail

Productive4.0

Call year: 2017
Productive4.0 is an ambitious holistic project addressing all domains of the Digital Industry, thus comprising the complete range of Industry 4.0.
Thumbnail

PRYSTINE

Call year: 2017
Fail-operational Urban Surround Perception (FUSION) based on robust Radar and LiDAR sensor fusion and control functions.
Thumbnail

R3-POWERUP

Call year: 2017
300mm Pilot Line for Smart Power and Power Discretes.
Thumbnail

REACTION

Call year: 2017
The first worldwide and European eight-inch SiC wafer pilot line facility for power technology.
Thumbnail

SCOTT

Call year: 2017
SCOTT will Significantly impact the European Union to achieve the full potential of the IoT.
Thumbnail

SECREDAS

Call year: 2017
Software for validating architecting methodologies, reference architectures, components and suitable integration.
Thumbnail

SILENSE

Call year: 2017
Acoustic technologies & concepts to activate and control devices by gesture, data communication, and indoor positioning.
Thumbnail

TAKEMI5

Call year: 2017
Discovering, developing and demonstrating lithographic, metrology, process and integration technologies enabling module integration for the 5nm node.
Thumbnail

TAPES3

Call year: 2017
Supporting the continuation of Moore’s law in line with the worldwide industry roadmap.
Thumbnail

TARANTO

Call year: 2017
Towards Advanced bicmos NanoTechnology platforms for rf to thz applications.
Thumbnail

WAKeMeUP

Call year: 2017

WAKeMeUP will set-up a pilot line for advanced microcontrollers with e

Thumbnail

WInSiC4AP

Call year: 2017
Wide band gap Innovative SiC for Advanced Power.
Thumbnail

3DAM

Call year: 2016
Development of a new generation of metrology and characterization tools and methodologies.
Thumbnail

AMASS

Call year: 2016
Open tool platform, ecosystem & self-sustainable community for assurance and certification of Cyber-Physical Systems.
Thumbnail

ASTONISH

Call year: 2016

Better, faster and cheaper diagnosis is one of the key challenges of modern healthcare.

Thumbnail

DELPHI4LED

Call year: 2016

The rise of LED technology is changing the ecosystem of the lighting industry.

Thumbnail

DENSE

Call year: 2016
Self-driving cars are a rapidly growing technology. They eliminate the human error which is responsible for the highest percentage of accidents.
Thumbnail

ENABLE S3

Call year: 2016

Highly automated systems help to solve many societal challenges but can be costly to develop, test and certify for safe use.

Thumbnail

IoSense

Call year: 2016
Boosting European ECS industry competitiveness with connected semiconductor pilot lines in Europe.
Thumbnail

SafeCOP

Call year: 2016

Next generation embedded systems are interconnected through wireless communication.

Thumbnail

SemI40

Call year: 2016
Speeding up Europe's semiconductors production in the Industry 4.0 applications.
Thumbnail

TAKE5

Call year: 2016
5nm patterning, supporting the International Technology Roadmap for Semiconductors.
Thumbnail

RobustSENSE

Call year: 2015
Enhanced sensing performance for more reliable automated and autonomous driving functions for safe operation under all driving conditions
Thumbnail

3CCAR

Call year: 2015

3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV).

Thumbnail

EnSO

Call year: 2015
Autonomous Micro Energy Sources (AMES) for the “Internet of Things” (IoT)
Thumbnail

EXIST

Call year: 2015
New technologies for innovative image sensors focused on enhancing and extending the capabilities of current CMOS imaging devices
Thumbnail

InForMed

Call year: 2015
A pilot line for micro-fabricated medical devices enabling optimal use of the technologies and competencies available in Europe
Thumbnail

MANTIS

Call year: 2015
Maintenance is expensive - from 30% to 50% of the total manufacturing cost. MANTIS will develop a Proactive Maintenance Service Platform Architecture designed to reduce the costs and create new ways to add value.
Thumbnail

OSIRIS

Call year: 2015

OSIRIS proposes a large improvement of Silicon Carbide (SiC) wafers.

Thumbnail

PowerBase

Call year: 2015
Strenghtening growth and strategic independence for European semiconductor industry
Thumbnail

PRIME

Call year: 2015
The goal of PRIME is to establish an open Ultra Low Power technology platform, containing all necessary design and architecture blocks and components needed to support supply of products for the IoT.
Thumbnail

R2POWER300

Call year: 2015
Pilot line for new generations of Smart Power and Discrete technologies
Thumbnail

REFERENCE

Call year: 2015
Today’s world is overwhelmingly digitalized. The integration of information and communication technologies in people’s lives is unprecedented, and the volume of data being constantly exchanged is growing drastically.
Thumbnail

SeNaTe

Call year: 2015
Paving the way to the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.
Thumbnail

SWARMs

Call year: 2015
Autonomous operations of underwater robots at new reduced operational cost, increased safety of tasks and help to expand the offshore sector.
Thumbnail

WAYTOGO FAST

Call year: 2015
Distributed research infrastructure in the nanoCMOS domain influencing the whole value chain of digital electronics in Europe.
Thumbnail

ADMONT

Call year: 2014
Advanced Distributed Pilot Line for More-than-Moore Technologies.