Semicon process equipment materials

Thumbnail

DIAS

Call year: 2020
DAIS will create an intelligence centred heterogeneous distributed edge computing systems and solutions.
Thumbnail

Energy ECS

Call year: 2020
The project will develop a set of technologies to improve the digitalization of e-mobility systems and related energy solutions.
Thumbnail

GaN4AP

Call year: 2020
GaN4AP will make GaN-based electronics one of the main technology for active devices in all power conversion systems in Europe.
Thumbnail

HiEFFICIENT

Call year: 2020
Highly efficient and reliable electric drivetrains based on modular, intelligent and highly integrated wide band gap power electronics modules.
Thumbnail

ID2PPAC

Call year: 2020
ID2PPAC demonstrates that Performance Power Area and Cost (PPAC) requirements for the 2nm node generation of leading-edge logic technology can be achieved.
Thumbnail

IMOCO4.E

Call year: 2020
IMOCO4.E provides vertically distributed, edge-to-cloud intelligence for machines, robots and other human-in-the-loop automation systems having actively controlled moving elements.
Thumbnail

MATQu

Call year: 2020
MATQu will validate technology options to produce SJJs on industrial 300 mm silicon-based process flows.
Thumbnail

StorAIge

Call year: 2020
StorAIge will develop and industrialize the FD-SOI 28nm and the next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies.
Thumbnail

TRANSFORM

Call year: 2020
TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry.
Thumbnail

iRel4.0

Call year: 2019
iRel40 has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain.
Thumbnail

IT2

Call year: 2019

Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommod

Thumbnail

VALU3S

Call year: 2019
VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements.
Thumbnail

MADEin4

Call year: 2018
Metrology Advances for Digitized Electronic Components and Systems Industry 4.0
Thumbnail

PIN3S

Call year: 2018
Pilot Integration of 3nm Semiconductor Technology.
Thumbnail

Power2Power

Call year: 2018
Power2Power fosters a holistic, digitised pilot line approach in the Power ECS domain by accelerating the transition of ideas to innovations.
Thumbnail

5G_GaN2

Call year: 2017
The fifth generation (5G) communications technologies will provide internet access to a wide range of applications.
Thumbnail

AFarCloud

Call year: 2017
It will provide a distributed platform for autonomous farming, which will allow the integration and cooperation of Cyber Physical Systems in real-time.
Thumbnail

EuroPAT-MASIP

Call year: 2017
Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses.
Thumbnail

HiPERFORM

Call year: 2017
Wide band-gap power electronics in the drivetrain of electric vehicles.
Thumbnail

I-MECH

Call year: 2017
Intelligent Motion Control Platform for Smart Mechatronic Systems
Thumbnail

OCEAN12

Call year: 2017

For the last years, electronic components become more and more widespread in the automotive industry.

Thumbnail

PRYSTINE

Call year: 2017
Fail-operational Urban Surround Perception (FUSION) based on robust Radar and LiDAR sensor fusion and control functions.
Thumbnail

R3-POWERUP

Call year: 2017
300mm Pilot Line for Smart Power and Power Discretes.
Thumbnail

TAKEMI5

Call year: 2017
Discovering, developing and demonstrating lithographic, metrology, process and integration technologies enabling module integration for the 5nm node.
Thumbnail

TAPES3

Call year: 2017
Supporting the continuation of Moore’s law in line with the worldwide industry roadmap.
Thumbnail

TARANTO

Call year: 2017
Towards Advanced bicmos NanoTechnology platforms for rf to thz applications.
Thumbnail

WAKeMeUP

Call year: 2017

WAKeMeUP will set-up a pilot line for advanced microcontrollers with e

Thumbnail

AMASS

Call year: 2016
Open tool platform, ecosystem & self-sustainable community for assurance and certification of Cyber-Physical Systems.
Thumbnail

IoSense

Call year: 2016
Boosting European ECS industry competitiveness with connected semiconductor pilot lines in Europe.
Thumbnail

TAKE5

Call year: 2016
5nm patterning, supporting the International Technology Roadmap for Semiconductors.
Thumbnail

3CCAR

Call year: 2015

3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV).

Thumbnail

EnSO

Call year: 2015
Autonomous Micro Energy Sources (AMES) for the “Internet of Things” (IoT)
Thumbnail

InForMed

Call year: 2015
A pilot line for micro-fabricated medical devices enabling optimal use of the technologies and competencies available in Europe
Thumbnail

OSIRIS

Call year: 2015

OSIRIS proposes a large improvement of Silicon Carbide (SiC) wafers.

Thumbnail

PowerBase

Call year: 2015
Strenghtening growth and strategic independence for European semiconductor industry
Thumbnail

PRIME

Call year: 2015
The goal of PRIME is to establish an open Ultra Low Power technology platform, containing all necessary design and architecture blocks and components needed to support supply of products for the IoT.
Thumbnail

R2POWER300

Call year: 2015
Pilot line for new generations of Smart Power and Discrete technologies
Thumbnail

REFERENCE

Call year: 2015
Today’s world is overwhelmingly digitalized. The integration of information and communication technologies in people’s lives is unprecedented, and the volume of data being constantly exchanged is growing drastically.
Thumbnail

SeNaTe

Call year: 2015
Paving the way to the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.
Thumbnail

WAYTOGO FAST

Call year: 2015
Distributed research infrastructure in the nanoCMOS domain influencing the whole value chain of digital electronics in Europe.
Thumbnail

ADMONT

Call year: 2014
Advanced Distributed Pilot Line for More-than-Moore Technologies.