DAIS will create an intelligence centred heterogeneous distributed edge computing systems and solutions.
Energy ECS
Call year: 2020
The project will develop a set of technologies to improve the digitalization of e-mobility systems and related energy solutions.
GaN4AP
Call year: 2020
GaN4AP will make GaN-based electronics one of the main technology for active devices in all power conversion systems in Europe.
HiEFFICIENT
Call year: 2020
Highly efficient and reliable electric drivetrains based on modular, intelligent and highly integrated wide band gap power electronics modules.
ID2PPAC
Call year: 2020
ID2PPAC demonstrates that Performance Power Area and Cost (PPAC) requirements for the 2nm node generation of leading-edge logic technology can be achieved.
IMOCO4.E
Call year: 2020
IMOCO4.E provides vertically distributed, edge-to-cloud intelligence for machines, robots and other human-in-the-loop automation systems having actively controlled moving elements.
MATQu
Call year: 2020
MATQu will validate technology options to produce SJJs on industrial 300 mm silicon-based process flows.
StorAIge
Call year: 2020
StorAIge will develop and industrialize the FD-SOI 28nm and the next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies.
TRANSFORM
Call year: 2020
TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry.
iRel4.0
Call year: 2019
iRel40 has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain.
IT2
Call year: 2019
Semiconductor research and development continuously focuses on surpassing present state-of-the-art Micro-Chips manufacturing technology to accommod
VALU3S
Call year: 2019
VALU3S aims to design, implement and evaluate state-of-the-art V&V methods and tools in order to reduce the time and cost needed to verify and validate automated systems with respect to safety, cybersecurity and privacy (SCP) requirements.
MADEin4
Call year: 2018
Metrology Advances for Digitized Electronic Components and Systems Industry 4.0
PIN3S
Call year: 2018
Pilot Integration of 3nm Semiconductor Technology.
Power2Power
Call year: 2018
Power2Power fosters a holistic, digitised pilot line approach in the Power ECS domain by accelerating the transition of ideas to innovations.
5G_GaN2
Call year: 2017
The fifth generation (5G) communications technologies will provide internet access to a wide range of applications.
AFarCloud
Call year: 2017
It will provide a distributed platform for autonomous farming, which will allow the integration and cooperation of Cyber Physical Systems in real-time.
HiPERFORM
Call year: 2017
Wide band-gap power electronics in the drivetrain of electric vehicles.
OCEAN12
Call year: 2017
For the last years, electronic components become more and more widespread in the automotive industry.
PRYSTINE
Call year: 2017
Fail-operational Urban Surround Perception (FUSION) based on robust Radar and LiDAR sensor fusion and control functions.
TAPES3
Call year: 2017
Supporting the continuation of Moore’s law in line with the worldwide industry roadmap.
WAKeMeUP
Call year: 2017
WAKeMeUP will set-up a pilot line for advanced microcontrollers with e
EuroPAT-MASIP
Call year: 2016
Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses.
I-MECH
Call year: 2016
Intelligent Motion Control Platform for Smart Mechatronic Systems
R3-POWERUP
Call year: 2016
300mm Pilot Line for Smart Power and Power Discretes.
TAKEMI5
Call year: 2016
Discovering, developing and demonstrating lithographic, metrology, process and integration technologies enabling module integration for the 5nm node.
TARANTO
Call year: 2016
Towards Advanced bicmos NanoTechnology platforms for rf to thz applications.
AMASS
Call year: 2015
Open tool platform, ecosystem & self-sustainable community for assurance and certification of Cyber-Physical Systems.
EnSO
Call year: 2015
Autonomous Micro Energy Sources (AMES) for the “Internet of Things” (IoT)
IoSense
Call year: 2015
Boosting European ECS industry competitiveness with connected semiconductor pilot lines in Europe.
PRIME
Call year: 2015
The goal of PRIME is to establish an open Ultra Low Power technology platform, containing all necessary design and architecture blocks and components needed to support supply of products for the IoT.
REFERENCE
Call year: 2015
Today’s world is overwhelmingly digitalized. The integration of information and communication technologies in people’s lives is unprecedented, and the volume of data being constantly exchanged is growing drastically.
TAKE5
Call year: 2015
5nm patterning, supporting the International Technology Roadmap for Semiconductors.
3CCAR
Call year: 2014
3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV).
ADMONT
Call year: 2014
Advanced Distributed Pilot Line for More-than-Moore Technologies.
InForMed
Call year: 2014
A pilot line for micro-fabricated medical devices enabling optimal use of the technologies and competencies available in Europe
OSIRIS
Call year: 2014
OSIRIS proposes a large improvement of Silicon Carbide (SiC) wafers.
PowerBase
Call year: 2014
Strenghtening growth and strategic independence for European semiconductor industry
R2POWER300
Call year: 2014
Pilot line for new generations of Smart Power and Discrete technologies
SeNaTe
Call year: 2014
Paving the way to the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.
WAYTOGO FAST
Call year: 2014
Distributed research infrastructure in the nanoCMOS domain influencing the whole value chain of digital electronics in Europe.
